• DocumentCode
    3094276
  • Title

    A systematic approach to modeling and analysis of transient faults in logic circuits

  • Author

    Miskov-Zivanov, Natasa ; Marculescu, Diana

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA
  • fYear
    2009
  • fDate
    16-18 March 2009
  • Firstpage
    408
  • Lastpage
    413
  • Abstract
    With technology scaling, the occurrence rate of not only single, but also multiple transients resulting from a single hit is increasing. In this work, we consider the effect of these multiple-event transients on the outputs of logic circuits. Our framework allows for the analysis of soft errors in logic circuits, including several aspects: estimation of the effect of both single and multiple transient faults on both combinational and sequential circuits, analysis of the impact of multiple flip-flop upsets in sequential circuits, and analysis of transient behavior of the soft error rate in the cycles following the hit. The proposed framework can be used to estimate the impact of transient faults stemming not only from radiation, but also other physical phenomena. The results obtained using the proposed framework show that output error rates, resulting from multiple-event transient or multiple-bit upsets can vary across different circuits by several orders of magnitude.
  • Keywords
    combinational circuits; error analysis; sequential circuits; transients; combinational circuits; logic circuits; multiple-event transients; sequential circuits; soft error analysis; transient faults; Circuit analysis; Circuit faults; Electromagnetic transients; Error analysis; Error correction codes; Flip-flops; Logic circuits; Sequential circuits; Transient analysis; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality of Electronic Design, 2009. ISQED 2009. Quality Electronic Design
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2952-3
  • Electronic_ISBN
    978-1-4244-2953-0
  • Type

    conf

  • DOI
    10.1109/ISQED.2009.4810329
  • Filename
    4810329