Parametric analysis to determine accurate interconnect extraction corners for design performance

In this paper we propose a technique to determine accurate interconnect extraction corners for a 65-nm design using parametric RC extraction and timing analysis. We calculate the sensitivity of a design metric such as hold slack to each interconnect variation parameter. These sensitivities are then sorted for a selected number of critical paths. Finally, we utilize this information to determine the parameters which lead to extraction corner cases in the design. The results has shown that parametric analysis is necessary for a better interconnect variation coverage in the design.