DocumentCode :
3094372
Title :
Benchmarking semiconductor manufacturing
Author :
Leachman, Robert C. ; Hodges, David A.
Author_Institution :
Center for Eng. Syst. Res., California Univ., Berkeley, CA, USA
fYear :
1997
fDate :
13-16 Oct 1997
Firstpage :
1
Lastpage :
6
Abstract :
We are studying the manufacturing performance of semiconductor wafer fabrication plants in the US, Asia, and Europe. There are great similarities in production equipment, manufacturing processes, and products produced at semiconductor fabs around the world. However, detailed comparisons over multi-year intervals show that important quantitative indicators of productivity, including defect density (yield), major equipment production rates, wafer throughput time, and effective new process introduction to manufacturing, vary by factors of 3 to as much as 5 across an international sample of 28 fabs. We conduct on-site observations, and interviews with manufacturing personnel at all levels from operator to general manager, to better understand reasons for the observed wide variations in performance. We have identified important factors in the areas of information systems, organizational practices, process and technology improvements, and production control that correlate strongly with high productivity. Optimum manufacturing strategy is different for commodity products, high-value proprietary products, and foundry business
Keywords :
integrated circuit manufacture; integrated circuit technology; integrated circuit yield; manufacturing data processing; manufacturing resources planning; process control; production control; semiconductor technology; commodity products; defect density; equipment production rates; foundry business; information systems; manufacturing performance; manufacturing personnel; manufacturing processes; optimum manufacturing strategy; organizational practices; process introduction effectiveness; process technology; production control; production equipment; productivity; proprietary products; quantitative productivity indicators; semiconductor fabs; semiconductor wafer fabrication; semiconductor wafer manufacturing benchmarking; wafer throughput time; wafer yield; Asia; Europe; Fabrication; Management information systems; Manufacturing processes; Personnel; Production equipment; Productivity; Semiconductor device manufacture; Throughput;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 1997 IEEE International
Conference_Location :
Lake Tahoe, CA
Print_ISBN :
0-7803-4205-4
Type :
conf
DOI :
10.1109/IRWS.1997.660271
Filename :
660271
Link To Document :
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