DocumentCode :
3095257
Title :
A study on impact of loading effect on capacitive crosstalk noise
Author :
Sanyal, Alodeep ; Pan, Abhisek ; Kundu, Sandip
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Massachusetts, Amherst, MA
fYear :
2009
fDate :
16-18 March 2009
Firstpage :
696
Lastpage :
701
Abstract :
Decreasing process geometries and increasing operating frequencies have made VLSI circuits more susceptible to signal integrity related failures. Capacitive crosstalk is one of the major causes for such kind of failures. Typically, crosstalk faults result from switching of neighboring lines that are capacitively coupled. As we move deep into nanometer regime, transistor gate leakage introduces considerable voltage noise in internal circuit nodes. This phenomenon is known as loading effect. The objective of this paper is to study the impact of this voltage noise on capacitive cross-talk related signal integrity problems. A simplified cross-talk analysis system assumes that all aggressors of a net can switch at the same time. This leads to excessive pessimism that can be reduced by considering the timing window of aggressor switching as well as their Boolean relationships. In order to evaluate the impact of loading effect on cross-talk noise, we devised a dynamic simulator that performs dynamic timing simulation. By performing simulations on ISCAS-85 benchmark circuits we established that loading effect is a significant aggravator of cross-talk noise that leads to increased number of failures. The main contributions of this paper are (i) showing that loading effect worsens cross-talk related signal integrity problems and (ii) an efficient dynamic timing simulator for simulating crosstalk effects that provide a quantities measure.
Keywords :
VLSI; crosstalk; delays; integrated circuit noise; VLSI circuits; capacitive crosstalk noise; loading effect impact; Circuit noise; Circuit simulation; Crosstalk; Frequency; Geometry; Signal processing; Switches; Timing; Very large scale integration; Voltage; ATPG; Capacitive cross-coupling; design rules check (DRC); dynamic simulation; inertial delay; leakage; loading effect; logic filtering; logic violation; signal integrity analysis; static analysis; timing filtering; transport delay;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality of Electronic Design, 2009. ISQED 2009. Quality Electronic Design
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2952-3
Electronic_ISBN :
978-1-4244-2953-0
Type :
conf
DOI :
10.1109/ISQED.2009.4810378
Filename :
4810378
Link To Document :
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