DocumentCode
3095532
Title
Post-Silicon Clock-nvert (PSCI) for reducing process-variation induced skew in buffered clock networks
Author
Akl, Charbel J. ; Ayoubi, Rafic A. ; Bayoumi, Magdy A.
Author_Institution
Univ. of Louisiana at Lafayette, Lafayette, LA
fYear
2009
fDate
16-18 March 2009
Firstpage
794
Lastpage
798
Abstract
Proposed in this paper is a post-silicon technique and circuits that reduce random process-variation induced skew with simple leaf buffers modification of a buffered clock network. If a timing violation due to clock skew occurs during testing, the present technique offers a second chance via Post-Silicon Clock-Invert (PSCI), which decreases the probability of having errors due to clock skew thus increasing timing yield or design performance. In the cases where the clock frequency of each chip is adjusted post-silicon to deal with inter-die process variations, this technique allows significant number of chips to operate at higher frequencies. The present technique does not require any modifications to the clock network and repower buffers, thus it has negligible area, power, and design overheads, and its post-silicon activity is simple and fast. Evaluated via Monte-Carlo simulation in the context of a 16 leaves buffered H-Tree topology in a 10-mmtimes10-mm synchronous region, PSCI shows an improvement of 19.56%, 28.39%, and 30.3% in the global clock skew mean, standard deviation, and worst case, respectively.
Keywords
Monte Carlo methods; buffer circuits; clocks; H-Tree topology; Monte-Carlo simulation; buffered clock networks; clock frequency; clock skew; post-silicon clock-invert; timing yield; Circuit testing; Clocks; Delay; Electronic mail; Frequency; Integrated circuit interconnections; Integrated circuit reliability; Manufacturing processes; Network topology; Timing; Buffered networks; clock skew; post-silicon activity; process variation;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality of Electronic Design, 2009. ISQED 2009. Quality Electronic Design
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-2952-3
Electronic_ISBN
978-1-4244-2953-0
Type
conf
DOI
10.1109/ISQED.2009.4810394
Filename
4810394
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