• DocumentCode
    3095592
  • Title

    A SAW-based high-speed spread-spectrum WLAN using chirp π/4-DQPSK modulation

  • Author

    Koller, R. ; Gugler, W. ; Springer, A. ; Weigel, R. ; Reindl, L.

  • Author_Institution
    Inst. for Commun. & Inf. Eng., Johannes Kepler Univ., Linz, Austria
  • Volume
    1
  • fYear
    2000
  • fDate
    36800
  • Firstpage
    367
  • Abstract
    A high data-rate wideband chirp spread spectrum system for indoor communication is implemented. The use of chirp signals with the well known pulse compression technique makes the system extremely robust and therefore suitable for applications in industrial environment. By using π/4-DQPSK modulation and overlapping chirp signals we get data rates up to 70 Mbps. There is no need for sophisticated digital signal processing due to the use of surface acoustic wave (SAW) filters for the generation and filtering of the chirp signals. Production tolerances, temperature drift, and other system imperfections are shown to be either negligible or can easily be tracked. Simulation results reveal that the limiting factor for the data rate is intersymbol interference caused by multipath propagation. A simple hardware demonstrator validates the simulation results
  • Keywords
    broadband networks; chirp modulation; differential phase shift keying; indoor radio; intersymbol interference; multipath channels; quadrature phase shift keying; spread spectrum communication; surface acoustic wave filters; wireless LAN; 70 Mbit/s; SAW filter; chirp π/4-DQPSK modulation; data communication; high-speed spread-spectrum WLAN; indoor communication; industrial environment; intersymbol interference; multipath propagation; pulse compression; wideband system; Chirp modulation; Digital filters; Digital signal processing; Indoor communication; Pulse compression methods; Robustness; Spread spectrum communication; Surface acoustic waves; Wideband; Wireless LAN;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2000 IEEE
  • Conference_Location
    San Juan
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-6365-5
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2000.922574
  • Filename
    922574