Title :
A complete transmit, receive, and LO buffer chip set in low cost SMT package covering 38 & 42 GHz applications
Author :
Morkner, Henrik ; Fujii, Kenichi ; Kumar, Sudhakar ; Phan, Kenny ; Niedzwiecki, T. ; Ostermann, B.
Author_Institution :
Avago Technologies INC, San Jose, United States
Abstract :
The higher frequency bands of the point-to-point infrastructure radio have been the hardest to convert to SMT package. This paper describes complete solution that covers 37–45GHz in 4 SMT packaged chips. Transmit consist of 2 chips, an up-converter/VGA with 20dB gain control and power amplifier that provides 38dBm OIP3. The receiver is a single chip down-converter with less than 4.9dB NF. The single chip LO buffer provides frequency multiplication (x2) and +21dBm drive with ample harmonic suppression. An optional high directivity, temperature compensated, power detector is also available to aid forward error correction. The result is the most integrated and complete chip set known to be published or advertised.
Keywords :
Costs; Frequency conversion; Gain control; Harmonics suppression; Noise measurement; Packaging; Power amplifiers; Radiofrequency amplifiers; Receivers; Surface-mount technology;
Conference_Titel :
Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4244-6056-4
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2010.5515236