DocumentCode
3095910
Title
CMOS transistor reliability and performance impacted by gate microstructure
Author
Yu, Bin ; King, Tsu-Jae ; Hu, Chenming ; Ju, Dong-Hyuk ; Kepler, Nick
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
fYear
1997
fDate
13-16 Oct 1997
Firstpage
35
Lastpage
41
Abstract
This paper investigate the impact of CMOS (complementary metal-oxide-semiconductor) gate microstructure on the reliability and performance of deep-submicrometer CMOS transistors. The amorphous silicon (α-Si) gate provides better capability for suppression of boron penetration in p+ doped gate p-channel MOSFETs, but gate depletion in the α-Si gate is slightly more severe than that of the poly-Si gate. The gate-length-dependent gate-depletion effect, in which the difference in linear gm between MOSFETs with two different gate microstructures shows a strong Lg-dependence, is reported and interpreted by impurity diffusion along the grain boundary. A gate nitrogen implant as an effective method for suppression of the boron diffusion is also discussed with emphasis on the impact on both device reliability and performance
Keywords
CMOS integrated circuits; MOSFET; doping profiles; grain boundary diffusion; integrated circuit design; integrated circuit reliability; integrated circuit testing; ion implantation; CMOS gate microstructure; CMOS transistor performance; CMOS transistor reliability; CMOS transistors; Si; Si:B; Si:N; SiO2-Si; a-Si gate; amorphous silicon gate; boron diffusion; boron penetration suppression; gate depletion; gate microstructure; gate nitrogen implant; gate-length-dependent gate-depletion effect; grain boundary impurity diffusion; linear transconductance; p+ doped gate p-channel MOSFETs; poly-Si gate; reliability; Amorphous silicon; Boron; CMOS process; CMOS technology; FETs; Implants; Integrated circuit technology; MOSFETs; Microstructure; Nitrogen;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 1997 IEEE International
Conference_Location
Lake Tahoe, CA
Print_ISBN
0-7803-4205-4
Type
conf
DOI
10.1109/IRWS.1997.660278
Filename
660278
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