• DocumentCode
    3096167
  • Title

    ScAlN Lamb wave resonator in GHz range released by XeF2 etching

  • Author

    Konno, Akitoyo ; Sumisaka, M. ; Teshigahara, Akihiko ; Kano, Kazuhiko ; Hashimo, Ken-ya ; Hirano, Harutoyo ; Esashi, Masayoshi ; Kadota, Mitsuhiro ; Tanaka, Shoji

  • Author_Institution
    Grad. Sch. of Eng., Tohoku Univ., Sendai, Japan
  • fYear
    2013
  • fDate
    21-25 July 2013
  • Firstpage
    1378
  • Lastpage
    1381
  • Abstract
    Recently, it was reported that the piezoelectric characteristic of AlN was enhanced by doping Sc, and that 40% Sc-doped AlN (Sc0.4Al0.6N) had approximately 5 times higher piezoelectricity than pure AlN. In this study, we designed, fabricated and evaluated Lamb wave resonators using a Sc0.4Al0.6N thin film. First, we examined elastic constants c44E and c44D of Sc0.4Al0.6N using a thickness-shear wave resonator excited by parallel electric field, and then designed Lamb wave resonators using revised material constants. The Lamb wave resonators were fabricated by electron beam lithography, reactive ion etching, XeF2 release etching etc. The maximum and average electromechanical coupling coefficients were 8.3% and 6.8%, respectively, for 2.6 GHz devices working in S0 mode.
  • Keywords
    III-V semiconductors; aluminium compounds; elastic constants; electron beam lithography; piezoelectric thin films; piezoelectricity; scandium compounds; semiconductor doping; semiconductor thin films; sputter etching; surface acoustic wave resonators; wide band gap semiconductors; Lamb wave resonators; Sc doping; Sc0.4Al0.6N; elastic constants; electromechanical coupling coefficients; electron beam lithography; parallel electric fields; piezoelectricity; reactive ion etching; revised material constants; shear wave resonator; thin films; Couplings; Etching; Films; Frequency measurement; III-V semiconductor materials; Resonant frequency; Lamb wave; Micro Electro Mechanical Systems (MEMS); Resonator; ScAlN;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2013 IEEE International
  • Conference_Location
    Prague
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4673-5684-8
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2013.0350
  • Filename
    6725020