DocumentCode :
3096410
Title :
3D structure band-pass filter implementation by vias and power/ground plane effect on testing load board
Author :
Yi-Ching Wu ; Yu-Chi Kuo ; Po-Hui Yu ; Sung-Mao Wu
Author_Institution :
Dept. of Electr. Eng., Nat. Univ. of Kaohsiung, Kaohsiung, Taiwan
fYear :
2012
fDate :
4-7 Dec. 2012
Firstpage :
544
Lastpage :
546
Abstract :
According to the design rule of process, the research presented a novel embedded filter for testing load board application. This structure is designed by the effect between vias, power and ground planes. The transmission line on print circuit board would not be influenced. In this paper, the rule of dimension for design band-pass filter is proposed. The simulation results of three operating frequencies are as following: the bandwidth of 1.95GHz filter is 23.2%, pass band insertion loss is -1.18dB and return loss is -13.39dB; the bandwidth of 2.52GHz filter is 30.1%, insertion loss is -1.05dB and return loss is -22.1dB; the bandwidth of 5.3GHz filter is 23.2%, insertion loss is -1.43dB and return loss is -14.99dB.
Keywords :
UHF filters; band-pass filters; passive filters; printed circuit testing; vias; 3D structure band-pass filter; embedded filter; frequency 1.95 GHz; frequency 2.52 GHz; frequency 5.3 GHz; ground plane effect; load board testing; loss 1.05 dB; loss 1.18 dB; loss 1.43 dB; loss 13.39 dB; loss 14.99 dB; loss 22.1 dB; power effect; vias implementation; Band pass filters; Bandwidth; Insertion loss; Microwave filters; Periodic structures; Power harmonic filters; Simulation; Band-pass filters; embedded; print circuit board (PCB); via;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference Proceedings (APMC), 2012 Asia-Pacific
Conference_Location :
Kaohsiung
Print_ISBN :
978-1-4577-1330-9
Electronic_ISBN :
978-1-4577-1331-6
Type :
conf
DOI :
10.1109/APMC.2012.6421658
Filename :
6421658
Link To Document :
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