DocumentCode :
30965
Title :
K-band bandpass filter using fully micromachined substrate integrated waveguide platform with dual copper posts in glass dielectrics
Author :
Ik-Jae Hyeon ; Chang-Wook Baek
Author_Institution :
Sch. of Electr. & Electron. Eng., Chung-Ang Univ., Seoul, South Korea
Volume :
51
Issue :
16
fYear :
2015
fDate :
8 6 2015
Firstpage :
1268
Lastpage :
1270
Abstract :
A K-band bandpass filter (BPF) based on the fully micromachined substrate integrated waveguide (SIW) structure has been demonstrated. In the proposed SIW platform, borosilicate glass reflowed into the silicon trench is used as a dielectric substrate, and the vias are formed by filling the glass mould with electroplated copper after removing the embedded silicon part. The BPF´s characteristics are realised by introducing dual inductive post structures into the SIW platform. The insertion loss and 3 dB bandwidth of the fabricated BPF were measured to be 2.46 dB at 29 GHz and 7.2%, respectively. The proposed BPF platform has high potential for low-loss, compact SIW-based millimetre-wave tunable filters owing to its mechanical robustness and integrity with MEMS tuning devices.
Keywords :
band-pass filters; dielectric materials; micromachining; micromechanical devices; substrate integrated waveguides; vias; waveguide filters; BPF characteristics; K-band bandpass filter; MEMS tuning devices; SIW structure; borosilicate glass; dielectric substrate; dual copper posts; dual inductive post structures; electroplated copper; frequency 29 GHz; fully micromachined substrate integrated waveguide platform; glass dielectrics; glass mould; loss 2.46 dB; low-loss compact SIW-based millimetre-wave tunable filters; silicon trench; vias;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el.2015.0921
Filename :
7175160
Link To Document :
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