• DocumentCode
    3097314
  • Title

    Temperature compensated bulk acoustic thin film resonators

  • Author

    Lakin, K.M. ; McCarron, K.T. ; McDonald, J.F.

  • Author_Institution
    TFR Technol. Inc., Bend, OR, USA
  • Volume
    1
  • fYear
    2000
  • fDate
    36800
  • Firstpage
    855
  • Abstract
    Thin film resonators have been made that exhibit a high degree of temperature compensation. These resonators are composed of piezoelectric aluminum nitride films, aluminum top and bottom electrodes, and are compensated with layers of silicon dioxide within the resonator. The resonators are fabricated with the solidly mounted resonator (SMR) configuration using a sequence of aluminum nitride and silicon dioxide reflector layers. Silicon dioxide has a positive temperature coefficient and can be used to offset the -25 ppm per degree C coefficient of aluminum nitride. Results are reported on hermetic packaging, temperature cycle testing, temperature coefficient measurements, and preliminary ageing
  • Keywords
    III-V semiconductors; acoustic resonators; aluminium; aluminium compounds; compensation; crystal resonators; packaging; piezoelectric semiconductors; piezoelectric thin films; semiconductor device testing; semiconductor thin films; silicon compounds; wide band gap semiconductors; Al-AlN-SiO2-Al; ageing; aluminum top electrodes; bottom electrodes; hermetic packaging; piezoelectric aluminum nitride films; positive temperature coefficient; reflector layers; silicon dioxide; solidly mounted resonator configuration; temperature coefficient measurements; temperature compensated bulk acoustic thin film resonators; temperature compensation; temperature cycle testing; Aluminum nitride; Electrodes; Film bulk acoustic resonators; Optical films; Packaging; Piezoelectric films; Semiconductor films; Silicon compounds; Temperature measurement; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2000 IEEE
  • Conference_Location
    San Juan
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-6365-5
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2000.922677
  • Filename
    922677