DocumentCode :
3097746
Title :
Correlation of charge-to-breakdown obtained from constant current stresses and ramped current stresses, and the implications for ultra-thin gate oxides
Author :
Dumin, Nels A.
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
fYear :
1997
fDate :
13-16 Oct 1997
Firstpage :
70
Lastpage :
74
Abstract :
Charge-to-breakdown (QBD) is one of the parameters that is used as a measure of oxide quality. In this work, the influence of the measurement conditions on QBD is examined, as well as the relationship between QBD and oxide thickness. Using oxides ranging from 45 Å to 80 Å, two QBD measurement methods are employed: constant current stress and exponential current ramp. A variety of current densities (for the constant current stress) and delay times (for the exponential current ramp) are studied. It is shown that not only does QBD depend on oxide thickness, but that QBD depends strongly on the measurement conditions, and that depending on the test conditions, QBD can increase or decrease as the oxide thickness decreases. It is also shown that there is a strong agreement between the QBD measured with a constant current stress and the Q(BD) measured with an exponential current ramp. Finally, the equipment-related limitations of the exponential current ramp are discussed, as well as the impact these limitations have on the underestimation of the resulting QBD
Keywords :
charge measurement; current density; dielectric thin films; electric breakdown; integrated circuit measurement; integrated circuit reliability; integrated circuit testing; Si; SiO2-Si; charge-to-breakdown; charge-to-breakdown measurement methods; constant current stress tests; constant current stresses; current density; delay time; exponential current ramp tests; measurement conditions; oxide quality; oxide thickness; ramped current stresses; test equipment-related limitations; ultra-thin gate oxides; Carbon capture and storage; Current density; Current measurement; Design for quality; Instruments; Monitoring; Silicon; Stress measurement; Thickness measurement; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 1997 IEEE International
Conference_Location :
Lake Tahoe, CA
Print_ISBN :
0-7803-4205-4
Type :
conf
DOI :
10.1109/IRWS.1997.660288
Filename :
660288
Link To Document :
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