• DocumentCode
    3097853
  • Title

    Modeling reliability of GaN/AlGaN/AlN/GaN HEMT

  • Author

    Padmanabhan, Balaji ; Vasileska, Dragica ; Goodnick, Stephen M.

  • Author_Institution
    Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
  • fYear
    2011
  • fDate
    7-9 Dec. 2011
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    III-V nitrides have attracted intense interest recently for applications in high-temperature, high-power electronic devices operating at microwave frequencies. Gallium Nitride (GaN), with a much larger band gap than Gallium Arsenide, has drawn recent interest in industry for use in blue laser diodes and microwave power field-effect transistors. Even though GaN has three times higher effective electron mass than GaAs, which results in a low-field mobility less than that of GaAs, GaN has some distinct advantages in various applications. Some of these are larger band gap, larger peak electron velocity, higher thermal stability; all of which enables it to be a very promising material for high power, high temperature and high frequency applications.
  • Keywords
    III-V semiconductors; aluminium compounds; energy gap; gallium compounds; high electron mobility transistors; high-temperature electronics; semiconductor device models; semiconductor device reliability; wide band gap semiconductors; GaN-AlGaN-AlN-GaN; HEMT reliability modelling; III-V nitrides; band gap; blue laser diodes; effective electron mass; high-temperature high-power electronic devices; low-field mobility; microwave frequency; microwave power field-effect transistors; thermal stability; Aluminum gallium nitride; Gallium nitride; HEMTs; Logic gates; Mathematical model; Strain; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Device Research Symposium (ISDRS), 2011 International
  • Conference_Location
    College Park, MD
  • Print_ISBN
    978-1-4577-1755-0
  • Type

    conf

  • DOI
    10.1109/ISDRS.2011.6135165
  • Filename
    6135165