Title :
Ultra compact RFICs using three-dimensional MMIC technology
Author :
Kaho, Takana ; Yamaguchi, Yo ; Nishikawa, Kenjiro ; Toyoda, Ichihiko ; Uehara, Kazuhiro
Author_Institution :
Network Innovation Labs., NTT Corp., Yokosuka, Japan
Abstract :
Since the 1980s, NTT has been developing three-dimensional (3D) monolith microwave integrated circuits (MMICs) to achieve small-size and low-cost ICs. The usage of 3D MMICs is a very powerful technique, especially at quasi-millimeter and millimeter wave levels. We describe the structure and features of 3D MMICs, introduce several MMIC subsystems, and point out future directions and plans for using 3D MMICs.
Keywords :
MMIC; millimeter wave levels; monolith microwave integrated circuits; quasimillimeter wave levels; three-dimensional MMIC technology; ultra compact RFIC; Conductive films; Impedance matching; Integrated circuit technology; MMICs; Microwave integrated circuits; Microwave technology; Monolithic integrated circuits; Polyimides; Radiofrequency integrated circuits; Thin film inductors; Three-dimensional MMIC; balun; directional coupler; high Q inductor; stacked inductor; transceiver;
Conference_Titel :
Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4244-6056-4
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2010.5515356
