Title :
Electrical design and analysis from die level to system level in advanced semiconductor engineering group
Author :
Chen-Chao Wang ; Ji-Han Chen ; Kuo-Hua Chen ; Chi-Tsung Chiu
Author_Institution :
Product Design Div., Adv. Semicond. Eng. (ASE) Inc., Kaohsiung, Taiwan
Abstract :
The scope of advanced semiconductor engineering (ASE) Inc. developments on microwave field including integration passive device (IPD), system-in-package (SiP), through silicon via (TSV), signal integrity(SI) and power integrity (PI) on system level, and Co-design/Co-simulation together with device modeling, integrated system analysis, measurement techniques over 60GHz, and design automatic platform have been presented. In this paper, the major development techniques at ASE will be introduced.
Keywords :
integrated circuit design; millimetre wave integrated circuits; millimetre wave measurement; ASE; IPD; SiP; TSV; advanced semiconductor engineering group; codesign-cosimulation; die level; electrical design; integration passive device; measurement techniques; microwave field; power integrity; signal integrity; system-in-package; through silicon via; Integrated circuit modeling; Layout; Metals; Semiconductor device measurement; Silicon; Through-silicon vias; Co-design; Co-simulation; IPD; OSD; PI; SI; TSV;
Conference_Titel :
Microwave Conference Proceedings (APMC), 2012 Asia-Pacific
Conference_Location :
Kaohsiung
Print_ISBN :
978-1-4577-1330-9
Electronic_ISBN :
978-1-4577-1331-6
DOI :
10.1109/APMC.2012.6421764
