DocumentCode
3098684
Title
Design automation of power integrated circuits in EDGE environment
Author
Hebrard, Luc ; Jacquemod, Gilles ; Boutherin, Bernard ; Le Helley, Michel
Author_Institution
LEAME, Ecole Centrale de Lyon, Ecully, France
fYear
1992
fDate
16-19 Mar 1992
Firstpage
252
Lastpage
256
Abstract
Presents SETIPIC, a software package to forecast the electrothermal interactions in the first design steps of power integrated circuits. To give a well-consistent interface with graphic tools to the designer, SETIPIC works under the EDGE CAD system. The software aspect of this integration into EDGE is explained. PICMOST, the thermal simulator used by SETIPIC to obtain the thermal distribution on the layout surface in a transient or stationary mode is also described. In particular, the method to take into account the chip environment (package...) with an automatic mesh to handle aleatory layout configurations is explained. Finally, some thermal simulation results are given
Keywords
circuit CAD; power integrated circuits; software packages; EDGE; EDGE CAD system; PICMOST; SETIPIC; aleatory layout configurations; automatic mesh; chip environment; design automation; electrothermal interactions; graphic tools; layout surface; power integrated circuits; software package; thermal distribution; thermal simulation; thermal simulator; Circuit simulation; Coupling circuits; Design automation; Electric variables; Electrothermal effects; Graphics; Packaging; Power integrated circuits; Predictive models; Software systems;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation, 1992. Proceedings., [3rd] European Conference on
Conference_Location
Brussels
Print_ISBN
0-8186-2645-3
Type
conf
DOI
10.1109/EDAC.1992.205933
Filename
205933
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