• DocumentCode
    3098684
  • Title

    Design automation of power integrated circuits in EDGE environment

  • Author

    Hebrard, Luc ; Jacquemod, Gilles ; Boutherin, Bernard ; Le Helley, Michel

  • Author_Institution
    LEAME, Ecole Centrale de Lyon, Ecully, France
  • fYear
    1992
  • fDate
    16-19 Mar 1992
  • Firstpage
    252
  • Lastpage
    256
  • Abstract
    Presents SETIPIC, a software package to forecast the electrothermal interactions in the first design steps of power integrated circuits. To give a well-consistent interface with graphic tools to the designer, SETIPIC works under the EDGE CAD system. The software aspect of this integration into EDGE is explained. PICMOST, the thermal simulator used by SETIPIC to obtain the thermal distribution on the layout surface in a transient or stationary mode is also described. In particular, the method to take into account the chip environment (package...) with an automatic mesh to handle aleatory layout configurations is explained. Finally, some thermal simulation results are given
  • Keywords
    circuit CAD; power integrated circuits; software packages; EDGE; EDGE CAD system; PICMOST; SETIPIC; aleatory layout configurations; automatic mesh; chip environment; design automation; electrothermal interactions; graphic tools; layout surface; power integrated circuits; software package; thermal distribution; thermal simulation; thermal simulator; Circuit simulation; Coupling circuits; Design automation; Electric variables; Electrothermal effects; Graphics; Packaging; Power integrated circuits; Predictive models; Software systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation, 1992. Proceedings., [3rd] European Conference on
  • Conference_Location
    Brussels
  • Print_ISBN
    0-8186-2645-3
  • Type

    conf

  • DOI
    10.1109/EDAC.1992.205933
  • Filename
    205933