DocumentCode :
3098716
Title :
Materials, processing, and characterization for flexible electronics
Author :
Wong, William S.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Waterloo, Waterloo, ON, Canada
fYear :
2011
fDate :
7-9 Dec. 2011
Firstpage :
1
Lastpage :
1
Abstract :
Summary form only given. Conventional methods of monolithic integration, such as photolithography and vacuum deposition, are reaching a practical limit for large-area electronics. In applications such as liquid-crystal display, the processed substrates continue to expand, with conventional fabrication of the displays becoming increasingly complex. The integration of inexpensive flexible substrates with organic and inorganic semiconductors provides an alternative method to reduce cost and complexity of large-area electronics fabrication. In addition to cost reduction, the integration of thin-film devices on plastic provides the opportunity for functionally-enhanced electronics where conformal image sensors provide enhanced resolution and potentially simplified optics.
Keywords :
amorphous semiconductors; elemental semiconductors; hydrogen; image sensors; lithography; p-i-n photodiodes; sensor arrays; silicon; thin film transistors; Si:H; displays fabrication; flexible electronics; functionally enhanced electronics; image sensor; inexpensive flexible substrate; inorganic semiconductor; large-area electronics fabrication; monolithic integration; organic semiconductor; thin-film device; Fabrication; Flexible electronics; Image sensors; Lithography; Polymers; Substrates; Thin film transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Device Research Symposium (ISDRS), 2011 International
Conference_Location :
College Park, MD
Print_ISBN :
978-1-4577-1755-0
Type :
conf
DOI :
10.1109/ISDRS.2011.6135212
Filename :
6135212
Link To Document :
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