Title :
2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167)
fDate :
April 30 2001-May 3 2001
Abstract :
The following topics were covered: product reliability; process and reliability interactions; MEMS reliability characterisation; packaging and assembly; oxide; wafer level reliability for interconnects; optoelectronics and compound semiconductors; ESD/latchup; failure analysis; process induced damage; interconnect reliability; hot carriers
Keywords :
assembling; electrostatic discharge; failure analysis; hot carriers; integrated circuit interconnections; micromechanical devices; optoelectronic devices; packaging; reliability; ESD; MEMS reliability characterisation; assembly; compound semiconductors; failure analysis; hot carriers; interconnect reliability; latchup; optoelectronics; oxide layers; packaging; process induced damage; process/reliability interactions; product reliability; wafer level reliability;
Conference_Titel :
Reliability Physics Symposium, 2001. Proceedings. 39th Annual. 2001 IEEE International
Conference_Location :
Orlando, FL, USA
Print_ISBN :
0-7803-6587-9
DOI :
10.1109/RELPHY.2001.922871
