Fast simulation of nonuniform substrate temperature effects on global GSI interconnects

An efficient method for transient analysis of on-chip coupled interconnects is presented considering nonuniform temperature profiles of the underlying substrate. The parametric macromodeling technique is performed to take into account the effects of substrate temperature. The waveform relaxation with transverse partitioning algorithm is employed for fast transient simulation of large coupled interconnects. With the proposed method, the impact of typical substrate thermal profiles on the performance of on-chip global interconnects is investigated. The efficiency and accuracy of the proposed method is demonstrated by a numerical example.