• DocumentCode
    3098963
  • Title

    Submicron ambipolar nanocrystalline-silicon TFTs with high-K gate dielectrics

  • Author

    Subramaniam, Anand ; Cantley, Kurtis D. ; Chapman, Richard A. ; Stiegler, Harvey J. ; Vogel, Eric M.

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Texas at Dallas, Richardson, TX, USA
  • fYear
    2011
  • fDate
    7-9 Dec. 2011
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Thin-film transistors (TFTs) that use hydrogenated nanocrystalline-silicon (nc-Si) as the channel material are favorable for use in neuromorphic circuits [1] as well as in flat-panel displays. Nanocrystalline-Si can be deposited over large areas at low temperatures, thus enabling three-dimensional integration with CMOS structures. Recently, nc-Si TFTs that exhibit high channel mobility and provide stable operation under voltage bias stress have been fabricated [2]. In this work, the subthreshold swing, electron and hole threshold voltages (VT), and field-effect mobilities are considerably improved by using high-K dielectrics instead of SiO2. These gains will translate to circuits with lower operating voltages at the same performance.
  • Keywords
    CMOS integrated circuits; electron mobility; elemental semiconductors; high-k dielectric thin films; hole mobility; nanostructured materials; silicon; thin film transistors; CMOS structure; channel material; field-effect mobility; flat-panel display; high channel mobility; high-κ gate dielectric; hole threshold voltage; hydrogenated nanocrystalline-silicon; neuromorphic circuit; submicron ambipolar nanocrystalline-silicon TFT; subthreshold swing; thin-film transistor; three-dimensional integration; voltage bias stress; Charge carrier processes; Dielectrics; Hafnium compounds; Inverters; Logic gates; Thin film transistors; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Device Research Symposium (ISDRS), 2011 International
  • Conference_Location
    College Park, MD
  • Print_ISBN
    978-1-4577-1755-0
  • Type

    conf

  • DOI
    10.1109/ISDRS.2011.6135227
  • Filename
    6135227