• DocumentCode
    3099022
  • Title

    Comparison of silicon-on-insulator and Body-on-Insulator FinFET based digital circuits with consideration on self-heating effects

  • Author

    Feng, Peijie ; Ghosh, Prasanta

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Syracuse Univ., Syracuse, NY, USA
  • fYear
    2011
  • fDate
    7-9 Dec. 2011
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    In summary, we have compared SOI and BOI FinFET device characteristics and the performance of digital circuits designed with those devices. For low voltage supply, SHE is modest in both devices and during digital circuit operations. SOI FinFET CMOS inverter and SRAM cell characteristics are very similar to BOI ones. Considering the lesser fabrication complexity, SOI FinFET thus would be more preferable than BOI FinFET for the design of low voltage digital circuits.
  • Keywords
    CMOS digital integrated circuits; MOSFET; SRAM chips; invertors; silicon-on-insulator; SOI FinFET CMOS inverter; SRAM cell characteristics; body-on-insulator FinFET; low voltage digital circuits; low voltage supply; self-heating effects; silicon-on-insulator; Digital circuits; FinFETs; Integrated circuit modeling; Inverters; Low voltage; Random access memory; Silicon on insulator technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Device Research Symposium (ISDRS), 2011 International
  • Conference_Location
    College Park, MD
  • Print_ISBN
    978-1-4577-1755-0
  • Type

    conf

  • DOI
    10.1109/ISDRS.2011.6135230
  • Filename
    6135230