DocumentCode
3099022
Title
Comparison of silicon-on-insulator and Body-on-Insulator FinFET based digital circuits with consideration on self-heating effects
Author
Feng, Peijie ; Ghosh, Prasanta
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Syracuse Univ., Syracuse, NY, USA
fYear
2011
fDate
7-9 Dec. 2011
Firstpage
1
Lastpage
2
Abstract
In summary, we have compared SOI and BOI FinFET device characteristics and the performance of digital circuits designed with those devices. For low voltage supply, SHE is modest in both devices and during digital circuit operations. SOI FinFET CMOS inverter and SRAM cell characteristics are very similar to BOI ones. Considering the lesser fabrication complexity, SOI FinFET thus would be more preferable than BOI FinFET for the design of low voltage digital circuits.
Keywords
CMOS digital integrated circuits; MOSFET; SRAM chips; invertors; silicon-on-insulator; SOI FinFET CMOS inverter; SRAM cell characteristics; body-on-insulator FinFET; low voltage digital circuits; low voltage supply; self-heating effects; silicon-on-insulator; Digital circuits; FinFETs; Integrated circuit modeling; Inverters; Low voltage; Random access memory; Silicon on insulator technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Device Research Symposium (ISDRS), 2011 International
Conference_Location
College Park, MD
Print_ISBN
978-1-4577-1755-0
Type
conf
DOI
10.1109/ISDRS.2011.6135230
Filename
6135230
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