A New Approach of 2D CMOS Thermal-Bubble-Based Accelerometer

Author

Yang, Yin-Ting ; Chen, Shu-Jung ; Lin, Wei-Te ; Tu, Wei-Hong ; Huang, Chun-An ; Liu, Wen-Ling ; Shen, Chih-Hsiung

Author_Institution

Nat. Changhua Univ. of Educ., chang hua

fYear

2007

fDate

5-8 Nov. 2007

Firstpage

2980

Lastpage

2984

Abstract

A novel thermal-bubble-based micromachined accelerometer with advantages of low solid thermal conductance and high sensitivity is presented in this paper. With our proposed micro-link structure, a new accelerometer was built with a micro heater, two pairs of thermopiles which were floating over an etched cavity. The micro-heater is centered on the membrane and two pairs of thermopiles besides are crossed with each other. The heater and the thermopiles are connected by network structure of micro-links, which enhance the structure and greatly reduce the solid heat flow from the heater to the hot junctions of thermopiles. Furthermore, the samples are fabricated by TSMC 0.35 mum 2P4M CMOS process which is provided by CIC with outstanding strong structures and uniform quality. Our design is proved to be adequate for commercial batch production.

Keywords

CMOS integrated circuits; accelerometers; micromechanical devices; thermopiles; 2D CMOS thermal-bubble-based accelerometer; TSMC; batch production; microheater; microlink structure; solid heat flow; solid thermal conductance; Acceleration; Accelerometers; Biomembranes; CMOS process; Etching; Heat transfer; Temperature sensors; Thermal conductivity; Thermal sensors; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Industrial Electronics Society, 2007. IECON 2007. 33rd Annual Conference of the IEEE

Conference_Location

Taipei

ISSN

1553-572X

Print_ISBN

1-4244-0783-4

Type

conf

DOI

10.1109/IECON.2007.4460215

Filename

4460215