DocumentCode :
3099173
Title :
Finite element analysis of mechanically amplified CMUTs
Author :
Unger, Alexander ; Hoffmann, Marco ; Min-Chieh Ho ; Kwan Kyu Park ; Khuri-Yakub, Butrus T. ; Kupnik, Mario
Author_Institution :
Brandenburg Univ. of Technol., Cottbus, Germany
fYear :
2013
fDate :
21-25 July 2013
Firstpage :
287
Lastpage :
290
Abstract :
We introduce the possibility of improving a single-cell capacitive micromachined ultrasonic transducer (CMUT) for air-coupled ultrasound by simply adding a hollow conical-shaped structure (horn) on top of the CMUT plate. The main objective is to improve both transmit and receive sensitivity by lowering the center-to-average displacement ratio, which for bending plate operated devices inherently is limited. In addition, for receive mode the force generated from the impinging sound pressure wave is concentrated to the center of the plate, resulting in larger signals and, in contrast to piston-shaped plates, the horn has the advantage of only moderately increasing the modal mass of the structure. By using finite element analysis and first sound pressure measurements of our modified CMUT, we demonstrate that this idea is feasible and promising for air-coupled CMUTs operating at frequencies below 150 kHz, as it has been been proven to be successful for commercially available piezoelectric-driven bending plate devices as well.
Keywords :
acoustic signal processing; bending; finite element analysis; piezoelectric transducers; plates (structures); structural acoustics; ultrasonic transducers; air-coupled CMUT; air-coupled ultrasound; bending plate; center-average displacement ratio; finite element analysis; first sound pressure measurements; hollow conical-shaped structure; impinging sound pressure wave; mechanically amplified CMUT plate; modal mass; piezoelectric-driven bending plate devices; piston-shaped plates; receive mode; receive sensitivity; single-cell capacitive micromachined ultrasonic transducer; transmit sensitivity; Acoustics; Aluminum; Finite element analysis; Frequency measurement; Silicon; Ultrasonic transducers; Voltage measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium (IUS), 2013 IEEE International
Conference_Location :
Prague
ISSN :
1948-5719
Print_ISBN :
978-1-4673-5684-8
Type :
conf
DOI :
10.1109/ULTSYM.2013.0074
Filename :
6725171
Link To Document :
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