DocumentCode
3099407
Title
A Study of High Concurrency Workload Influence on Modern Processor
Author
Chai, Baojie ; Liu, Dawei ; Zhao, Jie ; Yang, Wenjun
Author_Institution
Dept. of Comput. Sci. & Technol., Mudanjiang Normal Coll., Mudanjiang, China
fYear
2009
fDate
12-14 Dec. 2009
Firstpage
642
Lastpage
647
Abstract
This paper evaluates how concurrent users influence on processors and caches behavior of DBMSs on today´s hardware platform. AS TPC-C is currently the only active OLTP benchmark supported by the TPC. the main properties of TPC-C are that the database size and the number of users scale linearly with the throughput. Because main memory capability is limited and I/O is not a bottleneck, TPC-C benchmark is unsuitable for MMDBMSs. According to those properties, this paper proposes the ETPC-C benchmark for MMDBMSs. Then using hardware counters, we evaluate ETPC-C workload on MMDBMS. We find that the miss stall time is mostly spent on on-CPU-chip caches, that is, the first and second level cache misses are dominant. Furthermore, we find instruction cache (I-cache) stall time of on-CPU-chip is a major component to the memory stall time. The smaller the emulated users, the more proportion the i-cache stall time of on-CPU-chip contributes to the memory stall time. However, if employing index, the system under test (SUT) has more total i-cache stall time than the SUT without index at the same number of emulated users and data population.
Keywords
cache storage; data mining; database management systems; microprocessor chips; DBMS; TPC-C benchmark; active OLTP benchmark; database management systems; hardware counters; instruction cache; on-CPU-chip caches; processors; second level cache; system under test; Concurrent computing; Databases; Delay; Educational institutions; Hardware; Hazards; Paper technology; Pipelines; Random access memory; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Dependable, Autonomic and Secure Computing, 2009. DASC '09. Eighth IEEE International Conference on
Conference_Location
Chengdu
Print_ISBN
978-0-7695-3929-4
Electronic_ISBN
978-1-4244-5421-1
Type
conf
DOI
10.1109/DASC.2009.109
Filename
5380630
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