DocumentCode :
3099441
Title :
Progression of Superjunction Power MOSFET Devices
Author :
Chen, Yu ; Liang, Yung C. ; Samudra, Ganesh S. ; Feng, Hanhua
Author_Institution :
Nat. Univ. of Singapore, Singapore
fYear :
2007
fDate :
5-8 Nov. 2007
Firstpage :
1380
Lastpage :
1385
Abstract :
p-n column superjunction (SJ) MOSFET power devices are highly recognized for their higher blocking capability and lower specific on-state resistance. However, in practice, the performance of SJ devices is handicapped with difficulties in formation of perfect charge-balanced p-n columns due to the limitation of current process technology, especially for devices with small widths and low voltage rating. Novel structures of Polysilicon Flanked Superjunction (PF-SJ) and Oxide-bypassed (OB), Graded OB, Slanted OB Superjunction MOSFETs were previously proposed to overcome the SJ fabrication limitation. In this paper, the progression of superjunction power MOSFET device development is discussed with the new approaches on lateral structures demonstrated for future high power integrated circuit applications.
Keywords :
power MOSFET; polysilicon flanked superjunction; superjunction power MOSFET devices; Doping; Etching; Fabrication; MOSFET circuits; Medium voltage; Power MOSFET; Silicon on insulator technology; Substrates; Thermal conductivity; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics Society, 2007. IECON 2007. 33rd Annual Conference of the IEEE
Conference_Location :
Taipei
ISSN :
1553-572X
Print_ISBN :
1-4244-0783-4
Type :
conf
DOI :
10.1109/IECON.2007.4460230
Filename :
4460230
Link To Document :
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