DocumentCode :
3099548
Title :
Novel nodestructive and non-electrical-contact failure analysis technique laser-SQUID microscopy
Author :
Nikawa, Kiyoshi ; Inoue, Shingo
Author_Institution :
NEC Corporation
fYear :
2001
fDate :
2001
Firstpage :
288
Lastpage :
292
Keywords :
Bonding; Ceramics; Contacts; EPROM; Electronics packaging; Failure analysis; Large scale integration; Microscopy; National electric code; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 2001. Proceedings. 39th Annual. 2001 IEEE International
Print_ISBN :
0-7803-6587-9
Type :
conf
DOI :
10.1109/RELPHY.2001.922916
Filename :
922916
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3099548
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