DocumentCode

3099548

Title

Novel nodestructive and non-electrical-contact failure analysis technique laser-SQUID microscopy

Author

Nikawa, Kiyoshi ; Inoue, Shingo

Author_Institution

NEC Corporation

fYear

2001

fDate

2001

Firstpage

288

Lastpage

292

Keywords

Bonding; Ceramics; Contacts; EPROM; Electronics packaging; Failure analysis; Large scale integration; Microscopy; National electric code; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 2001. Proceedings. 39th Annual. 2001 IEEE International

Print_ISBN

0-7803-6587-9

Type

conf

DOI

10.1109/RELPHY.2001.922916

Filename

922916