DocumentCode :
3099582
Title :
Modeling of Heat Spreaders for Cooling Power and Mobile Electronic Devices
Author :
Angelov, George ; Tzanova, Slavka ; Avenas, Yvan ; Ivanova, Maria ; Takov, Tihomir ; Schaeffer, Christian ; Kamenova, Lora
Author_Institution :
Dept. of Microelectronics, Tech. Univ. of Sofia
fYear :
2005
fDate :
16-16 June 2005
Firstpage :
1080
Lastpage :
1086
Abstract :
The paper addresses theoretical and modeling issues of micro heat pipes with parallelepipedal shape with regard to the capillary limit and the evaporator boiling limit. In particular, the well-established Faghri model is employed to simulate the heat transfer capability of selected heat pipes developed and tested at the Laboratory of Electrotechnique of Grenoble. An improved model is suggested and it is compared with the simulation and experimental results. The improved model implements a different analytically derived form of the friction factor-Reynolds number product in the Faghri model. The simulated results with the proposed model demonstrate better coherence to the experiment showing the importance of accurate physical modeling to heat conduction behavior of the heat spreader
Keywords :
cooling; evaporation; heat pipes; mobile handsets; Faghri model; Laboratory of Electrotechnique of Grenoble; Reynolds number; capillary limit; evaporator boiling limit; friction factor; heat conduction; heat spreaders; heat transfer; micro heat pipes; mobile electronic devices; parallelepipedal shape; power cooling; Coolants; Electronics cooling; Heat sinks; Heat transfer; Laboratories; Microelectronics; Prototypes; Shape; Silicon; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics Specialists Conference, 2005. PESC '05. IEEE 36th
Conference_Location :
Recife
Print_ISBN :
0-7803-9033-4
Type :
conf
DOI :
10.1109/PESC.2005.1581763
Filename :
1581763
Link To Document :
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