DocumentCode
3099582
Title
Modeling of Heat Spreaders for Cooling Power and Mobile Electronic Devices
Author
Angelov, George ; Tzanova, Slavka ; Avenas, Yvan ; Ivanova, Maria ; Takov, Tihomir ; Schaeffer, Christian ; Kamenova, Lora
Author_Institution
Dept. of Microelectronics, Tech. Univ. of Sofia
fYear
2005
fDate
16-16 June 2005
Firstpage
1080
Lastpage
1086
Abstract
The paper addresses theoretical and modeling issues of micro heat pipes with parallelepipedal shape with regard to the capillary limit and the evaporator boiling limit. In particular, the well-established Faghri model is employed to simulate the heat transfer capability of selected heat pipes developed and tested at the Laboratory of Electrotechnique of Grenoble. An improved model is suggested and it is compared with the simulation and experimental results. The improved model implements a different analytically derived form of the friction factor-Reynolds number product in the Faghri model. The simulated results with the proposed model demonstrate better coherence to the experiment showing the importance of accurate physical modeling to heat conduction behavior of the heat spreader
Keywords
cooling; evaporation; heat pipes; mobile handsets; Faghri model; Laboratory of Electrotechnique of Grenoble; Reynolds number; capillary limit; evaporator boiling limit; friction factor; heat conduction; heat spreaders; heat transfer; micro heat pipes; mobile electronic devices; parallelepipedal shape; power cooling; Coolants; Electronics cooling; Heat sinks; Heat transfer; Laboratories; Microelectronics; Prototypes; Shape; Silicon; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics Specialists Conference, 2005. PESC '05. IEEE 36th
Conference_Location
Recife
Print_ISBN
0-7803-9033-4
Type
conf
DOI
10.1109/PESC.2005.1581763
Filename
1581763
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