DocumentCode :
3099778
Title :
Technology trends for future low cost phased arrays
Author :
Sarcione, Mike ; Puzella, Angelo
Author_Institution :
Raytheon Co., Sudbury, MA, USA
fYear :
2010
fDate :
23-28 May 2010
Firstpage :
688
Lastpage :
690
Abstract :
The next generation of active electronically scanned arrays (AESAs) is dependent upon many technology and application pulls and the pushes. RF and manufacturing technologies are key elements of achieving more affordable phased arrays in support of both military and commercial applications. Advanced, evolving, mature and even revolutionary device, material and packaging technologies are making significant strides for lowering the cost of phased arrays. To date, phased array usage has been limited to high end military and commercial applications. That´s about to change with the evolution of more affordable AESA architectures that take advantage of RF microelectronics, surface mount RF packaging and new architectures focused on reducing the high cost drivers. New Panel AESA approaches promise a savings of more than 50% since the initial nearly 20 years ago.
Keywords :
antenna phased arrays; surface mount technology; RF microelectronics; active electronically scanned arrays; antenna phased arrays; packaging technology; surface mount RF packaging; Bandwidth; CMOS technology; Costs; Government; Horses; Manufacturing; Packaging; Phased arrays; Radio frequency; Sensor arrays; AESA; AESLA; GaN; MMICs.; RF; SiGe; packaging; phased arrays; wide frequency bandwidths;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International
Conference_Location :
Anaheim, CA
ISSN :
0149-645X
Print_ISBN :
978-1-4244-6056-4
Electronic_ISBN :
0149-645X
Type :
conf
DOI :
10.1109/MWSYM.2010.5515448
Filename :
5515448
Link To Document :
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