Hydroxyapatite Deposited on Flat and porous Ti

Author

Jakubowicz, J. ; Adamek, G.

Author_Institution

Inst. of Mater. Sci. & Eng., Poznan Univ. of Technol., Poznan, Poland

fYear

2010

fDate

18-20 June 2010

Firstpage

1

Lastpage

4

Abstract

Abstract-Formation of porous Ti layer during electrochemical etching in H₃PO₄ + NH₄F, subsequent deposition of calcium-phosphate and corrosion behavior of the materials was described. Anodic etching results in surface roughening with pits diameter in the range of 7-12 μm. The subsequent cathodic electrochemical treatment, results in hydroxyapatite (HA) deposition. The source of Ca and P were two types of electrolytes: 0.1M HCl + 0.005M HA and 0.042M Ca(NO₃)₂ + 0.025M (NH₄)₂HPO₄ + 0.1M HCl. The formed HA layer has lamellas structure. The deposited calcium-phosphate layer could be useful for the osseointegration and presents excellent corrosion resistance in simulated body fluids. The corrosion current Ic for flat Ti, porous Ti and porous Ti with HA layer is: 3.9·10^-8 A·cm^-2, 2.52·10^-8 A·cm^-2 and 1.07·10^-8 A·cm^-2 respectively. It was found, that anodization and subsequent calcium-phosphate deposition, results in better corrosion resistance of the samples, with comparison to the sample without these treatments.

Keywords

anodisation; biomedical materials; calcium compounds; corrosion resistance; electrodeposition; electrolytes; etching; porous materials; surface roughness; titanium; Ca₁₀(PO₄)₆(OH)₂; Ti; anodic etching; anodization; calcium-phosphate; cathodic electrochemical treatment; corrosion behavior; corrosion resistance; electrochemical etching; electrolytes; flat-porous titanium layer; hydroxyapatite; lamellas structure; osseointegration; pit diameter; simulated body fluids; size 7 mum to 12 mum; subsequent deposition; surface roughening; Bones; Corrosion; Etching; Immune system; Implants; Rough surfaces; Surface resistance; Surface roughness; Surface treatment; Titanium;

fLanguage

English

Publisher

ieee

Conference_Titel

Bioinformatics and Biomedical Engineering (iCBBE), 2010 4th International Conference on

Conference_Location

Chengdu

ISSN

2151-7614

Print_ISBN

978-1-4244-4712-1

Electronic_ISBN

2151-7614

Type

conf

DOI

10.1109/ICBBE.2010.5515482

Filename

5515482