Title : 
High temperature immersion ultrasonic probes
         
        
            Author : 
Inoue, Takeru ; Iwata, Keiji ; Kobayashi, Masato
         
        
            Author_Institution : 
Grad. Sch. of Sci. & Technol., Kumamoto Univ., Kumamoto, Japan
         
        
        
        
        
        
            Abstract : 
Ultrasonic probes without delay line, in order to improve SNR thermal shock resistance were developed. New immersion probe was composed by PZT/PZT sol-gel composite film onto thin metal plate with protection case. High temperature durability was achieved because sol-gel composite film had good acoustic coupling without couplant, had reasonable broadband characteristic without backing material, and the sol-gel composite film itself had high thermal shock resistance due to porosity in the film. That immersion probe could operate even at 200°C in silicone oil bath. Further it was possible to receive second reflected echoes from top and bottom surface of a 36 mm thick aluminum and it indicated that this probe showed possibility of non-destructive testing such as crack detection.
         
        
            Keywords : 
composite materials; durability; high-temperature effects; lead compounds; nondestructive testing; piezoelectric thin films; sol-gel processing; thermal resistance; thermal shock; PZT-PZT; SNR thermal shock resistance; acoustic coupling; backing materials; crack detection; high temperature durability; high temperature immersion ultrasonic probes; nondestructive testing; porosity; protection case; reflected echoes; silicone oil bath; sol-gel composite thin films; temperature 200 degC; thin metal plate; Acoustics; Aluminum; Delay lines; Films; Probes; Temperature measurement; Temperature sensors; high-temperature; immersion probe; nondestructive testing; sol-gel composite; ultrasonic transuducer;
         
        
        
        
            Conference_Titel : 
Ultrasonics Symposium (IUS), 2013 IEEE International
         
        
            Conference_Location : 
Prague
         
        
        
            Print_ISBN : 
978-1-4673-5684-8
         
        
        
            DOI : 
10.1109/ULTSYM.2013.0121