• DocumentCode
    3100907
  • Title

    Investigation of delay path modifications of Surface Acoustic Wave sensors

  • Author

    Richardson, Mark ; Koochakzadeh, S. ; Bhethanabotla, Venkat R. ; Suthar, Kamlesh ; Sankaranarayanan, Subramanian K. R. S.

  • Author_Institution
    Dept. of Chem. & Biomed. Eng., Univ. of South Florida, Tampa, FL, USA
  • fYear
    2013
  • fDate
    21-25 July 2013
  • Firstpage
    1946
  • Lastpage
    1948
  • Abstract
    Surface Acoustic Wave (SAW) sensors monitor the interaction between a receptor and its target in real time through changes in the properties of the traveling wave (i.e. frequency or phase, and amplitude). A key sensing parameter is power consumption. To increase power transfer we have developed a SAW sensor with microcavities in the delay path on 36° YX LiTaO3 and 90° ST-X Quartz. Three parameters were identified that determine the effectiveness of microcavities: 1) IDT offset, 2) microcavity depth, and 3) microcavity cross-sectional area. Finite element (FE) simulations were performed using ANSYS to determine the optimum value of each parameter to decrease insertion loss (I.L.). Our results show that the best parameter values are; IDT offset = 10 μm, microcavity depth = 2.5 μm and microcavity cross-sectional area = 10 μm × 10 μm, for a device with center frequency of about 100 MHz.
  • Keywords
    finite element analysis; interdigital transducers; lithium compounds; microcavities; microsensors; quartz; surface acoustic wave sensors; surface acoustic wave transducers; ANSYS simulation; FE simulation; IDT offset; IL; LiTaO3; SAW sensor; ST-X quartz; delay path modification; depth 2.5 mum; finite element simulation; insertion loss; microcavity depth; power consumption; power transfer; surface acoustic wave sensor; traveling wave property; Finite element analysis; Lithium compounds; Microcavities; Sensors; Substrates; Surface acoustic wave devices; Surface acoustic waves; FEM; ST-quartz; Surface Acoustic Wave (SAW); insertion loss; lithium tantalate; microcavities;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2013 IEEE International
  • Conference_Location
    Prague
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4673-5684-8
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2013.0496
  • Filename
    6725256