Title :
Opto-electronic packaging of 2-D surface active devices
Author :
Basavanhally, Nagesh R. ; Brady, Michael F. ; Buchholz, D. Burce
Author_Institution :
AT&T Bell Labs., Princeton, NJ, USA
fDate :
31 Oct-3 Nov 1994
Abstract :
Summary form only given. A packaging scheme which provides both optical alignment and electrical interconnection during a single assembly process for SEED chip has been presented. The assembly of the package is cost-effective because the design lends itself to a batch assembly process. This packaging technique can be easily extended to other types of 2-D surface emitting devices
Keywords :
SEEDs; 2D surface active devices; 2D surface emitting devices; SEED chip; batch assembly process; cost-effective; electrical interconnection; optical alignment; optical interconnections; optoelectronic packaging; packaging scheme; packaging technique; single assembly process; Assembly; Lenses; Microoptics; Optical buffering; Optical devices; Optical interconnections; Packaging; Space technology; Temperature; Thermal management;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1994. LEOS '94 Conference Proceedings. IEEE
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-1470-0
DOI :
10.1109/LEOS.1994.586969
