Title :
Transformation of charge-to-breakdown obtained from ramped current stresses into charge-to-breakdown and time-to-breakdown domains for constant current stress
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Abstract :
Summary form only given. Charge-to-breakdown (QBD) is one of the parameters that is used as a measure of gate oxide quality. It has been shown that, under the correct measurement conditions, there is good agreement between the QBD that is measured with an exponential current ramp (ECR) and the QBD that is measured with a constant current stress (CCS), and that QBD depends strongly on the ramp rate of the exponential current ramp and the current density of the constant current stress (Dumin, Int. Integrated Reliability Workshop Final Report, 1997). Previous work has shown that the breakdown distribution obtained from a linear voltage ramp can be transformed into the constant voltage stress TDDB domain for time-to-breakdown (Berman, Int. Reliability Physics Symp., pp. 204-209, 1981). Similar to this, a method is presented here for transformation of the QBD distribution obtained from exponential ramp experiments into the constant current stress TDDB domains of time-to-breakdown (tBD) and QBD
Keywords :
dielectric thin films; electric breakdown; electric charge; electric current; integrated circuit measurement; integrated circuit reliability; integrated circuit testing; transforms; breakdown distribution; charge-to-breakdown; charge-to-breakdown domain; charge-to-breakdown transformation; constant current stress; constant current stress TDDB domains; constant current stress density; constant voltage stress TDDB domain; exponential current ramp; exponential current ramp rate; gate oxide quality; linear voltage ramp; measurement conditions; ramped current stresses; time-to-breakdown; time-to-breakdown domain; Breakdown voltage; Carbon capture and storage; Current density; Current measurement; Density measurement; Design for quality; Electric breakdown; Probability; Q measurement; Stress measurement;
Conference_Titel :
Integrated Reliability Workshop Final Report, 1997 IEEE International
Conference_Location :
Lake Tahoe, CA
Print_ISBN :
0-7803-4205-4
DOI :
10.1109/IRWS.1997.660307