DocumentCode :
3101608
Title :
Sub-atmospheric pressure pool boiling of water on a screen laminate-enhanced extended surface
Author :
Laca, Paul ; Wirtz, R.A.
Author_Institution :
Dept. of Mech. Eng./MS 312, Univ. of Nevada Reno, Reno, NV
fYear :
2009
fDate :
15-19 March 2009
Firstpage :
9
Lastpage :
16
Abstract :
Pool boiling experiments are conducted to investigate the heat transfer performance of screen laminate-enhanced extended surfaces in water at reduced pressures. Screen laminations of varying pore hydraulic diameter and specific surface area fine wire screen are bonded to an extended surface (fin). The fins have a 1 cm2 base cross section area, a 5 deg taper with heights of 1 cm and 2/3 cm. Pool temperatures are held at the saturation temperature for water at pressures of 0.2, 0.3, 0.5 and 1.0 atm. Boiling performance of a vertical and horizontal fin orientation is investigated. The 4 layer screen laminate enhanced fin with a 10K superheat sustains base heat fluxes of up to 140 W/cm2 at 1.0 atm, and up to 132 W/cm2 at 0.2 atm. These extended surfaces outperform screen laminates enhanced plane surface by up to 4 fold. A reduction in saturation pressure reduces the boiling performance for all laminates. Vertically oriented fins outperform horizontal fins.
Keywords :
boiling; heat transfer; laminates; boiling performance; heat transfer; pore hydraulic diameter; screen laminate-enhanced extended surface; subatmospheric pressure pool boiling; surface area fine wire screen; Bonding; Copper; Heat transfer; Hydraulic diameter; Laminates; Lamination; Mechanical engineering; Temperature; Water heating; Wire; Pool boiling; enhanced surface; extended surface; reduced pressure; screen laminate;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE
Conference_Location :
San Jose, CA
ISSN :
1065-2221
Print_ISBN :
978-1-4244-3664-4
Electronic_ISBN :
1065-2221
Type :
conf
DOI :
10.1109/STHERM.2009.4810736
Filename :
4810736
Link To Document :
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