• DocumentCode
    3101647
  • Title

    A condensate-less design of cold plate in vapor-compression system applicable to high-end computing

  • Author

    Wu, Yu-Lieh ; Yang, Kai-Shing ; Lin, Shih-Jie ; Chang, Wen-Ruey ; Wang, Chi-Chuan

  • Author_Institution
    Dept. of Refrigeration, Air Conditioning & Energy Eng., Nat. Chin-Yi Univ. of Technol., Taiping
  • fYear
    2009
  • fDate
    15-19 March 2009
  • Firstpage
    17
  • Lastpage
    21
  • Abstract
    A novel design featuring a two-stage expansion process is proposed in this study. Without any help of insulation, the design can minimize or even entirely eliminate the formation of condensate in the cold-plate surface for a typical refrigeration system. The design incorporates a double-pipe inlet outlet and a two-container cold plate. A detailed comparison is also made amid conventional cold plate and the present condensate-less cold plate. For the conventional cold plate, it is found that the refrigerant mass flowrate is almost unchanged with respect to heating load. However, a slight decrease of mass flowrate for the present condensate-less cold plate is seen due to additional expansion/contraction/friction loss occurring in the first container. In addition, the decay in mass flowrate results in a gradual decline of outlet temperature that is opposite to the conventional cold-plate design.
  • Keywords
    refrigeration; cold-plate design; cold-plate surface; condensate-less design; double-pipe inlet outlet; expansion-contraction-friction loss; refrigerant mass flowrate; refrigeration system; two-stage expansion process; vapor-compression system; CMOS technology; Cold plates; Electronics cooling; Heat transfer; Integrated circuit technology; Refrigeration; Temperature; Thermal conductivity; Thermal resistance; Thermoelectricity; Refrigeration; cold plate; condensate-less; two-stage expansion;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4244-3664-4
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/STHERM.2009.4810737
  • Filename
    4810737