Thermal load boards — another thermal management design tool

Author

Siegal, Bernie

Author_Institution

Thermal Eng. Assoc., Thermal Eng. Assoc., Inc., Mountain View, CA

fYear

2009

fDate

15-19 March 2009

Firstpage

65

Lastpage

69

Abstract

This paper describes a tool that can be used in the thermal management design of electronic printed circuit assemblies at both the board level and the system level. The thermal load board tool simulates actual thermal conditions that can be easily modeled and validated. The approach described herein is useful in minimizing electronic system development time and cost.

Keywords

printed circuits; thermal management (packaging); bare die simulation; electronic printed circuit assemblies; heat spreader; thermal load boards; thermal management design tool; thermal simulation; Application software; Assembly systems; Circuit simulation; Electronic packaging thermal management; Principal component analysis; Printed circuits; Thermal engineering; Thermal loading; Thermal management; Thermal management of electronics; Thermal Load Board (TLB); bare die simulation; heat spreader; package simulation; printed circuit assembly (PCA); simulation validation; thermal management design; thermal simulation;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE

Conference_Location

San Jose, CA

ISSN

1065-2221

Print_ISBN

978-1-4244-3664-4

Electronic_ISBN

1065-2221

Type

conf

DOI

10.1109/STHERM.2009.4810744

Filename

4810744