Title :
Thermal load boards — another thermal management design tool
Author_Institution :
Thermal Eng. Assoc., Thermal Eng. Assoc., Inc., Mountain View, CA
Abstract :
This paper describes a tool that can be used in the thermal management design of electronic printed circuit assemblies at both the board level and the system level. The thermal load board tool simulates actual thermal conditions that can be easily modeled and validated. The approach described herein is useful in minimizing electronic system development time and cost.
Keywords :
printed circuits; thermal management (packaging); bare die simulation; electronic printed circuit assemblies; heat spreader; thermal load boards; thermal management design tool; thermal simulation; Application software; Assembly systems; Circuit simulation; Electronic packaging thermal management; Principal component analysis; Printed circuits; Thermal engineering; Thermal loading; Thermal management; Thermal management of electronics; Thermal Load Board (TLB); bare die simulation; heat spreader; package simulation; printed circuit assembly (PCA); simulation validation; thermal management design; thermal simulation;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-3664-4
Electronic_ISBN :
1065-2221
DOI :
10.1109/STHERM.2009.4810744
