Title :
Validation and sensitivity analysis of an image processing technique to derive thermal conductivity variation within a printed circuit board
Author :
Blackmore, Byron
Author_Institution :
Mentor Graphics Corp., Dartmouth, MA
Abstract :
Thermal conduction into a printed circuit board is often an important part of the critical heat transfer path in electronic devices. Capturing the effect of the heterogeneous and anisotropic nature of the printed circuit board´s copper distribution on thermal resistance distribution is crucial for simulations of conduction dominated cooling solutions..
Keywords :
computational fluid dynamics; electronic engineering computing; finite volume methods; image processing; printed circuits; thermal conductivity; black image; black pixel distribution; critical heat transfer path; finite volume computational fluid dynamics; image processing; orthotropic material; printed circuit board; sensitivity analysis; tessellation resolution; thermal conduction; thermal conductivity; thermal resistance distribution; tiled array; white image; white pixel distribution; Anisotropic magnetoresistance; Circuit simulation; Copper; Electronics cooling; Heat transfer; Image processing; Printed circuits; Sensitivity analysis; Thermal conductivity; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-3664-4
Electronic_ISBN :
1065-2221
DOI :
10.1109/STHERM.2009.4810746
