DocumentCode
3102677
Title
Analysis of microvia interconnects
Author
Abhari, R. ; Van Deventer, T.E.
Author_Institution
Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
Volume
3
fYear
1998
fDate
7-12 June 1998
Firstpage
1925
Abstract
The development of high density circuitry has promoted the introduction of the microvia technology which relies on organic dielectrics and vertical interconnects of reduced dimensions. In this paper, microvia interconnects are evaluated both through simulation using an FDTD model and experimental measurements, and have shown good electrical performance.
Keywords
finite difference time-domain analysis; integrated circuit interconnections; FDTD model; microvia interconnect; organic dielectric; simulation; vertical interconnect; Circuit simulation; Crosstalk; Dielectric measurements; Dielectric substrates; Etching; Finite difference methods; Integrated circuit interconnections; Nonhomogeneous media; Plasma applications; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1998 IEEE MTT-S International
Conference_Location
Baltimore, MD, USA
ISSN
0149-645X
Print_ISBN
0-7803-4471-5
Type
conf
DOI
10.1109/MWSYM.1998.700959
Filename
700959
Link To Document