Title :
Analysis of microvia interconnects
Author :
Abhari, R. ; Van Deventer, T.E.
Author_Institution :
Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
Abstract :
The development of high density circuitry has promoted the introduction of the microvia technology which relies on organic dielectrics and vertical interconnects of reduced dimensions. In this paper, microvia interconnects are evaluated both through simulation using an FDTD model and experimental measurements, and have shown good electrical performance.
Keywords :
finite difference time-domain analysis; integrated circuit interconnections; FDTD model; microvia interconnect; organic dielectric; simulation; vertical interconnect; Circuit simulation; Crosstalk; Dielectric measurements; Dielectric substrates; Etching; Finite difference methods; Integrated circuit interconnections; Nonhomogeneous media; Plasma applications; Time domain analysis;
Conference_Titel :
Microwave Symposium Digest, 1998 IEEE MTT-S International
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-4471-5
DOI :
10.1109/MWSYM.1998.700959
