Title :
Review of non contact thermal mapping methods for electronic systems application
Author :
Ailani, S.R. ; Yagoub, M.C.E. ; Mohammadi, F.A.
Author_Institution :
Dept. of Electr. & Comput. Eng., Ryerson Univ., Toronto, ON
Abstract :
Silicon die surface and PCBs surface temperature can be used to monitor the health state of analog and digital integrated circuits. In present paper, different non contact temperature distribution techniques have been reviewed in detail from accuracy, reliability, complexity and industrial usability point of view. The methods discussed here are Infrared thermography, Interferometry and Thermoreflectance.
Keywords :
infrared imaging; interferometry; monolithic integrated circuits; temperature distribution; thermoreflectance; PCBs; analog integrated circuits; digital integrated circuits; electronic systems application; infrared thermography; interferometry; noncontact thermal mapping methods; silicon die surface; surface temperature; temperature distribution techniques; thermoreflectance; Cameras; Electronic packaging thermal management; Integrated circuit reliability; Monitoring; Optical interferometry; Power system reliability; Semiconductor device measurement; Temperature measurement; Temperature sensors; Thermal conductivity;
Conference_Titel :
Telecommunications, 2008. IST 2008. International Symposium on
Conference_Location :
Tehran
Print_ISBN :
978-1-4244-2750-5
Electronic_ISBN :
978-1-4244-2751-2
DOI :
10.1109/ISTEL.2008.4651413
