Review of non contact thermal mapping methods for electronic systems application

Author

Ailani, S.R. ; Yagoub, M.C.E. ; Mohammadi, F.A.

Author_Institution

Dept. of Electr. & Comput. Eng., Ryerson Univ., Toronto, ON

fYear

2008

fDate

27-28 Aug. 2008

Firstpage

821

Lastpage

824

Abstract

Silicon die surface and PCBs surface temperature can be used to monitor the health state of analog and digital integrated circuits. In present paper, different non contact temperature distribution techniques have been reviewed in detail from accuracy, reliability, complexity and industrial usability point of view. The methods discussed here are Infrared thermography, Interferometry and Thermoreflectance.

Keywords

infrared imaging; interferometry; monolithic integrated circuits; temperature distribution; thermoreflectance; PCBs; analog integrated circuits; digital integrated circuits; electronic systems application; infrared thermography; interferometry; noncontact thermal mapping methods; silicon die surface; surface temperature; temperature distribution techniques; thermoreflectance; Cameras; Electronic packaging thermal management; Integrated circuit reliability; Monitoring; Optical interferometry; Power system reliability; Semiconductor device measurement; Temperature measurement; Temperature sensors; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Telecommunications, 2008. IST 2008. International Symposium on

Conference_Location

Tehran

Print_ISBN

978-1-4244-2750-5

Electronic_ISBN

978-1-4244-2751-2

Type

conf

DOI

10.1109/ISTEL.2008.4651413

Filename

4651413