• DocumentCode
    3102924
  • Title

    Architecture and performance evaluation of 3D CMOS-NEM FPGA

  • Author

    Dong, Chen ; Chen, Chen ; Mitra, Subhasish ; Chen, Deming

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana Champaign, Champaign, IL, USA
  • fYear
    2011
  • fDate
    5-5 June 2011
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    In this paper, we introduce a reconfigurable architecture, named 3D CMOS-NEM FPGA, which utilizes Nanoelectromechanical (NEM) relays and 3D integration techniques synergistically. Unique features of our architecture include: hybrid CMOS-NEM FPGA look-up tables (LUTs) and configurable logic blocks (CLBs), NEM-based switch blocks (SBs) and connection blocks (CBs), and face-to-face 3D stacking. This architecture also has a built-in feature named direct link which is dedicated local communication channel using the short vertical wire between the two stacks to further enhance performance. A customized 3D FPGA placement and routing flow has been developed. By replacing CMOS components with NEM relays, a 19.5% delay reduction can be achieved compared to the baseline 2D CMOS architecture. 3D stacking together with NEM devices achieves a 31.5% delay reduction over the baseline. The best performance of this architecture is achieved by adding direct links, which provides a 41.9% performance gain over the baseline.
  • Keywords
    CMOS logic circuits; field programmable gate arrays; microrelays; nanoelectromechanical devices; reconfigurable architectures; table lookup; 3D CMOS-NEM FPGA architecture; 3D integration technique; CMOS component; NEM relay; NEM-based switch block; configurable logic block; customized 3D FPGA placement; direct link; face-to-face 3D stacking; hybrid CMOS-NEM FPGA look-up table; local communication channel; nanoelectromechanical relay; reconfigurable architecture; short vertical wire; CMOS integrated circuits; Field programmable gate arrays; Random access memory; Relays; Table lookup; Three dimensional displays; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    System Level Interconnect Prediction (SLIP), 2011 13th International Workshop on
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    978-1-4577-1240-1
  • Type

    conf

  • DOI
    10.1109/SLIP.2011.6135428
  • Filename
    6135428