Title :
Inverter Dynamic Electro-Thermal Modeling and Simulation with Experimental Verification
Author :
Reichl, J. ; Lai, J.S. ; Hefner, A. ; McNutt, T. ; Berning, D.
Author_Institution :
Future Energy Electron. Center, Virginia Polytech. Inst. & State Univ., Blacksburg, VA
Abstract :
A full electro-thermal simulation of a three-phase space-vector-modulated (SVM) inverter is performed and validated with measurements. Electrical parameters are extracted over temperature for the insulated gate bipolar transistor (IGBT) and diode electro-thermal models. A thermal network methodology that includes thermal coupling between devices is applied to a six-pack module package containing multiple IGBT and diode chips. The electro-thermal device models and six-pack module thermal model are used to simulate SVM inverter operation at several power levels. Good agreement between model and measurement is obtained for steady state operation of the three-phase inverter. In addition, transient heating of a single IGBT in the six-pack module is modeled and validated, yielding good agreement
Keywords :
insulated gate bipolar transistors; invertors; IGBT; SVM inverter; diode chips; diode electrothermal models; insulated gate bipolar transistor; inverter dynamic electrothermal modeling; parameter extraction; six-pack module; six-pack module package; steady state operation; thermal coupling; thermal network methodology; three-phase space-vector-modulation; Diodes; Heating; Insulated gate bipolar transistors; Inverters; Packaging; Performance evaluation; Semiconductor device measurement; Steady-state; Support vector machines; Temperature;
Conference_Titel :
Power Electronics Specialists Conference, 2005. PESC '05. IEEE 36th
Conference_Location :
Recife
Print_ISBN :
0-7803-9033-4
DOI :
10.1109/PESC.2005.1581939
