DocumentCode
310321
Title
Potential ceramics processing applications with high-energy electron beams
Author
Struve, K.W. ; Turman, B.N.
Author_Institution
Mission Res. Corp., Albuquerque, NM, USA
fYear
1993
fDate
7-9 June 1993
Firstpage
117
Abstract
Summary form only given. At a recent workshop organized to explore opportunities for electron beam processing of ceramics, several applications were identified for further development. These were ceramic joining, fabrication of ceramic powders, and surface processing of ceramics. It may be possible to join ceramics by either electron-beam brazing or welding. Brazing with refractory metals might also be feasible. The primary concern for brazing is whether the braze material can wet to the ceramic when rapidly heated by an electron beam. Raw ceramic powders, such as silicon nitride and aluminum nitride, which are difficult to produce by conventional techniques, could possibly be produced by vaporizing metals in a nitrogen atmosphere. Experiments need to be done to verify that the vaporized metal can fully react with the nitrogen. By adjusting beam parameters, high-energy beams can be used to remove surface flaws which are often sites of fracture initiation. They can also be used for surface cleaning. The advantage of electron beams over ion beams for this application is that the heat deposition can be graded into the material.
Keywords
ceramics; aluminum nitride; beam parameters; braze material; ceramic joining; ceramic powders; ceramics processing; electron beam heating; electron beam processing; electron-beam brazing; fracture initiation; heat deposition; high-energy beams; high-energy electron beams; metal vapourisation; nitrogen atmosphere; raw ceramic powers; refractory metals; silicon nitride; surface cleaning; surface flaws; welding; Aluminum nitride; Ceramics; Electron beams; Fabrication; Nitrogen; Powders; Silicon; Surface cleaning; Surface cracks; Welding;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Science, 1993. IEEE Conference Record - Abstracts., 1993 IEEE International Conference on
Conference_Location
Vancouver, BC, Canada
ISSN
0730-9244
Print_ISBN
0-7803-1360-7
Type
conf
DOI
10.1109/PLASMA.1993.593163
Filename
593163
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