Title :
The effect of elevated temperature lifetest on low frequency noise performance in GaAs PHEMT dual gate MMICs [LNA example]
Author :
Chou, Y.C. ; Callejo, L. ; Biedenbander, M. ; Lee, K. ; Allen, B. ; Lai, R. ; Kan, Q. ; Grundbacher, R. ; Leung, D. ; Eng, D. ; Block, T. ; Oki, Aaron
Author_Institution :
Northrop Grumman Space Technol., Redondo Beach, CA, USA
Abstract :
The dual gate layout configuration has become a versatile approach for compact and high performance MMIC design for commercial, and military/space applications. In this paper, we describe a method that was developed to lifetest compact (0.81 mm/sup 2/) dual gate GaAs PHEMT low noise amplifiers (LNAs) operating from DC to 1 GHz. The objective of the lifetest is to evaluate the effect of elevated temperature on low frequency noise performance from 10-40 MHz. The results exhibit a decrease of noise figure (NF) at 10-40 MHz (approximately 0.25 to 0.5 dB) in a dual gate LNA subjected to lifetest at T/sub ambient/ of 200/spl deg/C. This might be attributed to the gate leakage current reduction at either the interface of gate metal-AlGaAs or nitride-AlGaAs, thus possibly reducing the effect of generation-recombination (primary origin of low frequency noise). On the other hand, the change of noise figure at frequencies beyond 100 MHz is not noticeable. In summary, we have demonstrated a method to effectively lifetest a compact and high performance MMIC designed with a dual gate configuration.
Keywords :
HEMT integrated circuits; III-V semiconductors; MMIC amplifiers; UHF amplifiers; electron-hole recombination; gallium arsenide; integrated circuit noise; leakage currents; life testing; 0 Hz to 1 GHz; 10 to 40 MHz; 200 degC; GaAs; PHEMT dual gate MMIC; dual gate LNA; elevated temperature lifetest; gate leakage current reduction; generation-recombination effects; low frequency noise performance; low noise amplifiers; Frequency; Gallium arsenide; Leakage current; Low-frequency noise; Low-noise amplifiers; MMICs; Noise figure; Noise measurement; PHEMTs; Temperature;
Conference_Titel :
ROCS Workshop, 2004.[Reliability of Compound Semiconductors]
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7908-0105-1
DOI :
10.1109/ROCS.2004.184348