Novel modeling approach for multi-walled CNT bundle in global VLSI interconnects

Multi-walled carbon nanotube (MWCNT) bundles have potentially provided attractive solution over Cu or other materials used in global VLSI interconnects. Initially, this research paper proposes an equivalent single conductor (ESC) of MWCNT which is well accurate to a multiple transmission line RLC network with an average error of 1.67% or below. Finally, a novel modeling approach of MWCNT bundles with different dimensions is introduced that contains different number of shells. On an average, the MWCNT bundle with dimension 44×90nm² exhibits an improvement in delay of 68.52% and 27.42% over bundle dimension 12×24nm² and 28×56nm² respectively at different interconnect lengths.