Title :
The effect of Bi on the IMC growth in Sn-3Ag-0.5Cu solder interface during aging process
Author :
Qi, Lin ; Zhao, Jie ; Wang, Xiu-min ; Wang, Lai
Author_Institution :
Dalian Univ. of Technol., China
Abstract :
The solder materials used to make the solder joints for this study are: eutectic Sn-3Ag-0.5Cu solder; Sn-3Ag-0.5Cu-1Bi solder; and Sn-3Ag-0.5Cu-3Bi quaternary solder. In order to study the microstructure evolution and the IMC growth kinetics, the solder joints were aged isothermally in a resistance oven at 150±5°C with different periods of 0, 50, 100, 250, 500, and 1000 hours. The result show that: the morphology of IMC changes from scallop-like to planar in the aging process; the mean thickness of IMC layer solder joints is found to increase linearly with the square root of aging time, namely the growth of IMC is controlled by atom diffusion; the IMC growth rate decreased as Bi content increased. For the solders discussed above, the comparative IMC growth rate sequence from fast to slow is Sn-3Ag-0.5Cu > Sn-3Ag-0.5Cu-1Bi > Sn-3g-0.5Cu-3Bi.
Keywords :
ageing; bismuth alloys; copper alloys; crystal microstructure; crystal morphology; diffusion; eutectic alloys; silver alloys; solders; tin alloys; 100 hour; 1000 hour; 145 to 155 degC; 250 hour; 50 hour; 500 hour; IMC growth kinetics; IMC growth rate sequence; SnAgCu; SnAgCuBi; atom diffusion; eutectic solder; isothermal solder joint aging process; lead-free solder; microstructure evolution; planar morphology; quaternary solder; resistance oven; scallop-like morphology; solder interface; Aging; Atomic layer deposition; Bismuth; Joining materials; Kinetic theory; Microstructure; Morphology; Ovens; Soldering; Thickness control;
Conference_Titel :
Business of Electronic Product Reliability and Liability, 2004 International Conference on
Print_ISBN :
0-7803-8361-3
DOI :
10.1109/BEPRL.2004.1308147
