A machine vision system of ball grid array inspection on RT-Linux OS

Author

Nianjiong, Xia ; Qixin, Cao ; Zhuang, Fu ; Lee, Jey

Author_Institution

Res. Inst. of Robotics, Shanghai Jiaotong Univ., China

fYear

2004

fDate

Apr 27-30, 2004

Firstpage

81

Lastpage

85

Abstract

In this paper, a machine vision system for ball grid array (BGA) inspection is proposed. The binocular vision system can provide enough geometrical information by an optical approach for monitoring the quality of solder balls. A new optical method for BGA lead coplanarity measurement has been proposed, whose feasibility was verified in theory. This study is focused on algorithms for evaluating the critical characteristics, including the height of solder balls, the size of solder balls, coplanarity, and pitch, which are used to detect solder ball defects. These algorithms are implemented on an RT-Linux operating system. It provides a reference for the development of higher-speed and real-time inspection methods.

Keywords

automatic optical inspection; ball grid arrays; computer vision; image processing; operating systems (computers); quality control; BGA inspection; RT-Linux OS; ball grid array inspection; ball height; ball pitch; ball size; binocular vision system; geometrical relationship; machine vision system; optical lead coplanarity measurement method; real-time image processing; real-time inspection; solder ball quality monitoring; threshold segmentation; Acoustic signal detection; Acoustic waves; Automatic optical inspection; Electronics packaging; Geometrical optics; Integrated circuit packaging; Lead; Machine vision; Microscopy; X-ray lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Business of Electronic Product Reliability and Liability, 2004 International Conference on

Print_ISBN

0-7803-8361-3

Type

conf

DOI

10.1109/BEPRL.2004.1308154

Filename

1308154