Title :
Silicon Damage Mechanism In Oxide Etch
Author :
Yang, Ming ; Nakata, Kenichi
Author_Institution :
Texas Instruments, Inc.
Keywords :
Chemicals; Diodes; Fabrication; Instruments; Plasma applications; Plasma chemistry; Plasma devices; Silicon; Sputter etching; Ultra large scale integration;
Conference_Titel :
Plasma Process-Induced Damage, 1997., 2nd International Symposium on
Conference_Location :
Monterey, California, USA
Print_ISBN :
0-9651-5771-7
DOI :
10.1109/PPID.1997.596694
