DocumentCode

310844

Title

Silicon Damage Mechanism In Oxide Etch

Author

Yang, Ming ; Nakata, Kenichi

Author_Institution

Texas Instruments, Inc.

fYear

1997

fDate

13-14 May 1997

Firstpage

69

Lastpage

72

Keywords

Chemicals; Diodes; Fabrication; Instruments; Plasma applications; Plasma chemistry; Plasma devices; Silicon; Sputter etching; Ultra large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Plasma Process-Induced Damage, 1997., 2nd International Symposium on

Conference_Location

Monterey, California, USA

Print_ISBN

0-9651-5771-7

Type

conf

DOI

10.1109/PPID.1997.596694

Filename

596694