Title :
Soft Silicon Etch Using Microwave Downstream Plasma For Removal Of Plasma Etch Induced Damage
Author :
Deshmukh, Subhash ; Nelson, Mark
Author_Institution :
American Microsystems, Inc.
Keywords :
Etching; Plasma applications; Plasma chemistry; Plasma devices; Plasma materials processing; Plasma properties; Plasma waves; Silicon; Substrates; Testing;
Conference_Titel :
Plasma Process-Induced Damage, 1997., 2nd International Symposium on
Conference_Location :
Monterey, California, USA
Print_ISBN :
0-9651-5771-7
DOI :
10.1109/PPID.1997.596699
