Title :
A Complete Approach To The In-line Monitoring Of Materials Defects Introduced In Dielectric And Si By Plasma Processing
Author :
Nauka, K. ; Theil, J. ; Lagowski, J. ; Jastrzebski, L. ; Sawtchouk, S.
Author_Institution :
Hewlett-Packard Company
Keywords :
Corona; Dielectric materials; Monitoring; Plasma applications; Plasma devices; Plasma diagnostics; Plasma materials processing; Plasma measurements; Plasma properties; Surface discharges;
Conference_Titel :
Plasma Process-Induced Damage, 1997., 2nd International Symposium on
Conference_Location :
Monterey, California, USA
Print_ISBN :
0-9651-5771-7
DOI :
10.1109/PPID.1997.596716
